References
[1] Tsuruoka N, Watanabe M, Takayama S, Seki T, Matsunaga T, Haga Y. "Brief Effect of Acupoint Stimulation Using Focused Ultrasound." J Altern Complement Med. 2013;19(5):416-419. doi:10.1089/acm.2012.0217
[2] KRISS (Korea Research Institute of Standards and Science). Water tank acoustic pressure verification of MUTi pMUT chip, 35V excitation.
[3] P&K Skin Research Center. Clinical efficacy studies of MUTi device (Studies 1 & 2, 2025), 390 data points, Cutometer/F-ray/Antera 3D measurements.
[4] Cho K, Kim B, Kim Y, Lee S, Song J. "cMUT Probe Cooling Design by Thermal Network." Samsung Advanced Institute of Technology. IEEE IUS 2012. doi:10.1109/ULTSYM.2012.0157
[5] Song J, Jung S, Kim Y, Cho K, Kim B, Lee S, Na J, Yang I, Kwon O, Kim D. "Reconfigurable 2D cMUT-ASIC Arrays for 3D Ultrasound Image." Samsung Electronics / Hanyang University. Proc. SPIE 8320, 83201A (2012). doi:10.1117/12.911263
[6] Kim B, Kim Y, Lee S, Cho K, Song J. "Design and Test of A Fully Controllable 64x128 2-D CMUT Array Integrated with Reconfigurable Front-end ASICs for Volumetric Ultrasound Imaging." Samsung Advanced Institute of Technology. IEEE IUS 2012. doi:10.1109/ULTSYM.2012.0019
[7] Kim B, Song J, Lee S, Cho K, Kim Y, Jeon T. "Volumetric Ultrasound Image-Forming Using Fully Controllable 2-D CMUT-on-ASIC Arrays." Samsung Advanced Institute of Technology, Medical System Lab.
[8] Kim B, Lee S, Song J, Kim Y, Jeon T, Cho K. "Phase-Rotation Based Receive-Beamformer for Miniaturized Volumetric Ultrasound Imaging Scanners Using 2-D CMUT-on-ASIC Arrays." Samsung Advanced Institute of Technology. Proc. SPIE 8675, 86750D (2013). doi:10.1117/12.2006588
[9] Kim B, Lee S, Kim Y, Cho K, Jeon T, Kim K, Song J. "An Experimental Study on Coded Excitation in CMUT Arrays to Utilize Simultaneous Transmission Multiple-zone Focusing Method with Frequency Divided Sub-band Chirps." Samsung Advanced Institute of Technology. IEEE IUS 2013. doi:10.1109/ULTSYM.2013.0362
[10] Kim Y, Cho K, Kim B, Lee S, Jeon T, Song J. "2D Capacitive Micromachined Ultrasound Transducer Using Novel Tiling Based on Silicon Frame." Samsung Advanced Institute of Technology. Proc. SPIE 8675, 86750E (2013). doi:10.1117/12.2006140
Patents (Inventor: Kyungil Cho, Samsung Electronics)
[11] US Patent 8,974,393 B2, "Ultrasonic Probe" (filed 2013, granted 2015) — heat spreader and dissipation module for an IC bonded to a cMUT.
[12] US Patent 10,660,612 B2, "Ultrasound Probe and Ultrasound Imaging Device" — cMUT tile configurations and 4x4 matrix array structures.
[13] US Patent 9,071,893 B2, "Multi-Array Ultrasonic Probe Apparatus and Method" — cMUT arrays bonded to the upper surface of ASICs.
[14] US Patent 10,292,680 B2, "Ultrasonic Probe and Manufacturing Method Thereof" (with Samsung Electronics and Kyungpook National University) — cMUT arrays bonded to ICs with flexible PCB integration.
[15] US Patent Application 2013/0341303 A1, "Jig, Manufacturing Method Thereof, and Flip Chip Bonding Method for cMUT" — structural manufacturing technique for thin cMUT films during flip-chip bonding.